SAP SE (ADR) (NYSE:SAP) has introduced the HANA Cloud Platform (HCP) for the Internet of Things on Wednesday. To further strengthen its IOT portfolio, the company has also entered into a pact with Siemens AG (ADR) (OTCMKTS:SIEGY) and Intel Corporation (NASDAQ:INTC).
The HCP is developed embracing the prevailing SAP technology including geolocation, telematics, and predictive analytics. It allows the firms to establish a connection directly to the device and gather vital data.
SAP’s executive board member, Bernd Leukert has emphasized the importance of HCP for the Internet of Things. He has explained how HCP can be utilized in applications for smart cities, logistics, cars and smart vending machines.
According to Leukert, the HCP can be embraced to collect important data directly from the devices and process it in real time. The businesses can benefit a lot from the predictive capabilities of HCP.
Therefore, the businesses can utilize HCP to link all of the devices up to the boardroom and achieve success.
The HCP can be used by the companies for its Internet of Things. The companies can also leverage the new platform to offer the service for its clientele.
The alliance with Intel and Siemens will further cement SAP’s push for IoT.
As per the terms of the accord, SAP will seek the help of Intel in developing interoperable tools for IoT that works with HPC in accelerating the simplified deployments.
Intel will coordinate with SAP to jointly frame a concept to integrate SAP Cloud with Intel’s Gateway for IoT.
The Germany-based Siemens will utilize SAP’s HCP to offer customized cloud to its industrial clientele. It enables the industries to collect and analyze large streams of data directly from the products. The company also aims to open the HCP based IT eco system for the manufacturers and developers alike.
SAP SE (ADR) (NYSE:SAP) also entered into a pact with Jasper, a provider of IoT platform across the world, in March. Both agreed to integrate HCP with Jasper’s IoT.