Wall Street PR

Applied Materials, Inc. (NASDAQ:AMAT) Finally Comes Up With Cost-Effective Vertical Integration of 3D Chips

Boston, MA 06/04/2014 (wallstreetpr) – Applied Materials, Inc. (NASDAQ:AMAT) is a leading company that offers innovations in equipments, services and softwares so that it can manufacture advance semiconductor, flat panel displays and solar photovoltaic products like no one else in the market. The main aim of AMAT is to make innovation affordable and accessible to people all around the world. With this notion and aim in mind, the company finally has made through the challenges and is ready to offer cost-effective vertical integration of 3D chips. This innovation by AMAT once again is revolutionary and is going to attract visionaries and entrepreneurs in huge lots.

The Endura® VenturaTM PVD system leads to smaller and high-performance integrated 3D chips

Recently,Applied Materials, Inc. (NASDAQ:AMAT) introduced the Endura® VenturaTM PVD system to the market which will help the customers in reducing the cost of manufacturing smaller, high-performance, lower power integrated 3D chips. After 15 years of leadership in copper interconnect technology, the company has come up with this system which flaunts AMAT’s latest innovation and also demonstrates its expertise in precision material engineering. The company deploys titanium in volume production as an alternate barrier material to reduce the cost. With this innovation, it is sure that AMAT is expanding its abilities in wafer level packaging (WLP) applications which include TSVs, RDL and Bump.

The Endura Ventura system results in more cost-effective TSVs than any previous industry solutions

TSVs forms the basis of vertically fabricating lower power and smaller mobiles and high-bandwidth devices in the future and this new Ventura system overcomes many challenges in this fabrication. As a result Applied Materials, Inc. (NASDAQ:AMAT) now has more cost-effective TSVs than any previous industry solutions. Such higher-performance and compact chip packages that work on a lower power consumption are the next demands of the computing field. And after its launch, many customers have realized the significance of this innovation and have approved it for volume manufacturing.

Published by Benjamin Roussey

Benjamin Roussey is from Sacramento, California. He has two master’s degrees and served four years in the U.S. Navy. His bachelor’s degree is from CSUS (1999) where he was on a baseball pitching scholarship. His second master’s degree is an MBA in Global Management from the University of Phoenix (2006). He has worked for small businesses, public agencies, and large corporations. He has lived in Korea and Saudi Arabia where he was an ESL instructor. Benjamin spends his time in between Northern California and Cabo San Lucas, Mexico, committing himself to his craft of freelance and website writing. http://www.facebook.com/ben.rouss